Capacity: 8GB / 16GB / 32GB
Frequency : 4800 / 5200 / 5600
JEDEC specification voltage: VDD=1.1V/VDDQ=1.1V/VPP=1.8V
Number of chips: 8 or 16
Operating temperature: Working temperature 0 ℃ -95 ℃, storage temperature -50 ℃ -100 ℃
XMP：optional
Application : PC/Laptop/Thin Client/Network/Industrial/Embedded

Capacity: 8GB / 16GB / 32GB
Frequency : 4800 / 5200 / 5600
JEDEC specification voltage: VDD=1.1V/VDDQ=1.1V/VPP=1.8V
Number of chips: 8 or 16
Operating temperature: Working temperature 0 ℃ -95 ℃, storage temperature -50 ℃ -100 ℃
XMP：optional
Application : PC/Laptop/Thin Client/Network/Industrial/Embedded

Capacity: 4GB / 8GB/16GB
Frequency: 1600
JEDEC specification voltage: 1.5V /1.35V
Number of chips: 8 or16
Operating temperature: standard 0℃ - 85℃, wide temperature -25℃ - 95℃, industrial grade -40℃ - 95℃
Gold finger thickness: 30U
Application: Network/Industrial/Embedded

Capacity: 4GB / 8GB / 16GB
Frequency: 1333 / 1600 / 1866
JEDEC specification voltage: 1.5V /1.35V
Number of chips: 8 or 16
Operating temperature: standard 0℃ - 85℃, wide temperature -25℃ - 95℃, industrial grade -40℃ - 95℃
Gold finger thickness: 30U
Application: PC / Embedded

Capacity: 8GB / 16GB / 32GB
Frequency : 2133 / 2400 / 2666
JEDEC specification voltage: 1.2V
Number of chips: 8 or 16
Operating temperature: standard 0℃ - 85℃, wide temperature -25℃ - 95℃, industrial grade -40℃ - 95℃
Gold finger thickness: 30U
Application : PC/Laptop/Thin Client/Network/Industrial/Embedded

Capacity: 8GB / 16GB / 32GB
Frequency : 2133 / 2400 / 2666
JEDEC specification voltage: 1.2V
Number of chips: 8 or 16
Standard 0℃ - 85℃, Wide temperature -25℃ - 95℃, Industrial grade -40℃ - 95℃
Gold finger thickness: 30U
Application : PC / Embedded / Military / Transportation